Work

Growth, selectivity and adhesion of CVD-deposited copper from Cu+1 (hexafluoroacetylacetonate trimethylvinylsilane) and dichlorodimethylsilane

Year: 1995

Type: article

Source: Thin Solid Films

DOI: 10.1016/0040-6090(95)06706-x

Authors: James B. Webb, Daniel Northcott, Ismail Emesh

Institutions: Institute for Microstructural Sciences, National Research Council Canada, Nortel (Canada)

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2004153465

FWCI: 1.234

Cites: 7

Cited by: 17

Related to: 10