Work

Method development for the cyclic characterization of thin copper layers for PCB applications

Year: 2014

Type: article

Source: Circuit World

DOI: 10.1108/cw-09-2013-0032

Authors: K. Fellner, P.F. Fuchs, G. Pinter, T. Antretter, T. Krivec

Institutions: Polymer Competence Center Leoben (Austria), Montanuniversität Leoben, AT&S (Austria)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2004178382

FWCI: 0.863

Cites: 12

Cited by: 10

Related to: 10