Analytical methods used for low temperature Cu–Cu wafer bonding process evaluation
Year: 2015
Type: article
Source: Microsystem Technologies
Institutions: EV Group (Austria), Johannes Kepler University of Linz
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2004254651