Electromigration Induced Metal Dissolution in Flip-Chip Solder Joints
Year: 2005
Type: article
Abstract: The failure of flip chip solder joints through the dissolution of the Cu metallization was studied. From the location and geometry of the dissolved Cu, it can be concluded that current crowding played a critical role in the dissolution. It can also be concluded that temperature, as an experimental variable, is not less import than the current density in electromigration study. Experimentally, no evidence of mass transport due to thermomigration was observed.
Source: Materials science forum
Authors: Y.H. Lin, C.M. Tsai, Y.C. Hu, Y.L. Lin, J.Y. Tsai, C.R. Kao
Institutions: National Cheng Kung University, National Central University
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: hybrid
Funder: National Science Council
OpenAlex ID: W2004875576