Work

Electric feed-through for vacuum package using double-side anodic bonding of silicon-on-insulator wafer

Year: 2013

Type: article

Source: Journal of Electrostatics

DOI: 10.1016/j.elstat.2012.12.028

Authors: Hoang Manh Chu, Hung Ngoc Vu, Kazuhiro Hane

Institutions: Trường Đại học Khoa học và Công nghệ Hà Nội, Hanoi University of Science and Technology, Tohoku University

Language: English

Topic: Advanced MEMS and NEMS Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: Japan Society for the Promotion of Science

Award: Three-Dimensionarlly Stacked Optoelectronic System-on-Chip Fabricated Using Grapho-Assembly

OpenAlex ID: W2005106505

FWCI: 1.116

Cites: 21

Cited by: 16

Related to: 10