Work

Experimental investigations and model study of moisture behaviors in polymeric materials

Year: 2009

Type: article

Source: Microelectronics Reliability

DOI: 10.1016/j.microrel.2009.03.006

Authors: X.J. Fan, S.W.R. Lee, Q. Han

Institutions: Lamar University, South China University of Technology, Hong Kong University of Science and Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2005373647

FWCI: 10.03

Cites: 37

Cited by: 179

Related to: 10