Work

Capability study and challenges to sub-2x nm node contact hole patterning

Year: 2013

Type: conference-paper

Source: Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE

DOI: 10.1117/12.2011434

Authors: Wan-Lin Kuo, Ya-Ting Chan, Meng-Feng Tsai, Yi-Shiang Chang, Chia-Chi Lin, Ming-Chien Chiu, Chun-Hsun Chen, Hung-Ming Wu, Mao-Hsing Chiu

Institution: Powerchip (Taiwan)

Language: English

Topic: Advancements in Photolithography Techniques

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2005454143

FWCI:

Cites: 6

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Related to: 10