Work

Optimization of reflow soldering process for BGA packages by artificial neural network

Year: 2007

Type: article

Source: Microelectronics International

DOI: 10.1108/13565360710745610

Authors: Yu‐Hsin Lin, Wei‐Jaw Deng, Jie‐Ren Shie, Yung‐Kuang Yang

Institutions: Minghsin University of Science and Technology, Chung Hua University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2005758372

FWCI: 0.611

Cites: 11

Cited by: 14

Related to: 10