A Study of the Planarity by Sti Cmp Erosion Modeling
Year: 1999
Type: article
Source: MRS Proceedings
DOI: 10.1557/proc-566-33
Institutions: Samsung (South Korea), Samsung Electronics (South Korea)
Language: English
Subfield: Industrial and Manufacturing Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2006080827
