Work

Effect of layer properties on stress evolution, intermetallic volume, and density during tin whisker formation

Year: 2011

Type: article

Source: JOM

DOI: 10.1007/s11837-011-0178-z

Authors: Eric Chason, Nitin Jadhav, Fei Pei

Institution: Brown University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2006199255

FWCI: 1.734

Cites: 19

Cited by: 30

Related to: 10