Work

Evaluation of ultra-low-k dielectric materials for advanced interconnects

Year: 2001

Type: article

Source: Journal of Electronic Materials

DOI: 10.1007/s11664-001-0032-0

Authors: C. Jin, S. Lin, J. T. Wetzel

Institution: Texas Instruments (United States)

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: University of Texas at Austin

OpenAlex ID: W2007492862

FWCI: 2.432

Cites: 13

Cited by: 56

Related to: 10