Packaging Reliability for High Temperature Electronics: A Materials Focus
Year: 1996
Type: article
Source: Microelectronics International
Authors: F.P. McCluskey, L. Condra, T. Torri, J. Fink
Institutions: University of Maryland, College Park, Boeing (United States)
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2007676484