Work

Numerical and experimental characterization of the thermal behavior of a packaged DRAM-on-logic stack

Year: 2012

Type: conference-paper

Source: IEEE Electronic Components and Technology Conference (ECTC)

DOI: 10.1109/ectc.2012.6248970

Authors: H. Oprins, V. O. Cherman, B. Vandevelde, G. Van der Plas, P. Marchal, E. Beyne

Institution: IMEC

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2009145358

FWCI: 7.761

Cites: 24

Cited by: 29

Related to: 10