Work

Reliability Improvement of Solder Joints Between Ceramic Chip Resistors and Insulated Metal Substrates With Thick Copper Pads

Year: 2005

Type: conference-paper

Source: ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK)

DOI: 10.1115/ipack2005-73176

Author: Kenji Monden

Institution: Denka (Japan)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: Instituto Mexicano del Seguro Social

OpenAlex ID: W2009591934

FWCI:

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