Work

Acceleration of the growth of tin whisker by thermal aging and external tension

Year: 2014

Type: conference-paper

Source: International Conference on Electronic Packaging Technology (ICEPT)

DOI: 10.1109/icept.2014.6922835

Authors: Z.X. Yao, L.M. Yin, Y.H. Lu, W. Gang, Z.G. Chen, Z.X. Yao

Institutions: Chongqing University, Chongqing University of Science and Technology, State Key Laboratory of Mechanical Transmission

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2010045407

FWCI: 0.802

Cites: 12

Cited by: 2

Related to: 10