Work

Eliminating Electronic Component Stresses through Controlled Laser Soldering

Year: 1988

Type: article

Source: Hybrid Circuits

DOI: 10.1108/eb044334

Authors: R. Vanzetti, A.C. Traub

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2010168046

FWCI:

Cites: 4

Cited by:

Related to: 10