Work

Tungsten metallization for LSI applications

Year: 1974

Type: article

Source: Journal of Vacuum Science and Technology

DOI: 10.1116/1.1318073

Authors: R. S. Wagner, A. K. Sinha, T. T. Sheng, H. J. Levinstein, F. B. Alexander

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2010189152

FWCI: 3.328

Cites:

Cited by: 77

Related to: 10