Work

Nanoindentation characterization of intermetallic compounds formed between Sn–Cu (–Ni) ball grid arrays and Cu substrates

Year: 2009

Type: article

Source: Materials Science and Engineering B

DOI: 10.1016/j.mseb.2009.06.013

Authors: Hideaki Tsukamoto, Zhigang Dong, Han Huang, Tetsuro Nishimura, Kazuhiro Nogita

Institutions: The University of Queensland, NIHON SUPERIOR CO., LTD. (Japan)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2010554185

FWCI: 3.286

Cites: 28

Cited by: 43

Related to: 10