Work

Lead-free photoimageable silver conductor paste formulation for high density electronic packaging

Year: 2006

Type: article

Source: Materials Science and Engineering B

DOI: 10.1016/j.mseb.2006.02.027

Authors: Supriya A. Ketkar, Govind G. Umarji, Girish J. Phatak, Jalindar D. Ambekar, I.C. Rao, Uttam P. Mulik, Dinesh P. Amalnerkar

Institution: Centre for Materials for Electronics Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2010609807

FWCI: 1.641

Cites: 2

Cited by: 14

Related to: 10