Mechanical and Electrical Properties of Au-Al and Cu-Al Intermetallics Layer at Wire Bonding Interface
Year: 2003
Type: article
Source: Journal of Electronic Packaging
DOI: 10.1115/1.1604809
Authors: Tan Chee Wei, Abdul Razak Daud
Institution: National University of Malaysia
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Funder: Universiti Kebangsaan Malaysia
OpenAlex ID: W2010802259