Work

The physics of Cu pillar bump interconnect under electromigration stress testing

Year: 2014

Type: conference-paper

Source: Electronic System-Integration Technology Conference (ESTC)

DOI: 10.1109/estc.2014.6962759

Authors: Yu-Hsiang Hsiao, Chien-Fan Chen, Ping-Feng Yang, Chang-Chi Lee, Min-Chi Liu, Kwang-Lung Lin, Chiao-Wen Chen, Bradford J. Factor

Institutions: Advanced Semiconductor Engineering (Taiwan), National Cheng Kung University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2011089787

FWCI: 0.401

Cites: 16

Cited by: 5

Related to: 10