Work

Studies of Bonding Mechanisms and Failure Modes in Thermocompression Bonds of Gold Plated Leads to Ti-Au Metallized Substrates

Year: 1971

Type: conference-paper

Source: IEEE International Reliability Physics Symposium proceedings

DOI: 10.1109/irps.1971.362512

Authors: A. T. English, J. L. Hokanson

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2012015386

FWCI:

Cites:

Cited by: 10

Related to: 10