Work

The combined effects of ultrasonic wave and electric field on the microstructure and properties of Sn2.5Ag0.7Cu0.1RE/Cu soldered joints

Year: 2014

Type: article

Source: Journal of Materials Science Materials in Electronics

DOI: 10.1007/s10854-014-1783-8

Authors: Keke Zhang, Xiaojiao Zhang, Ranfeng Qiu, Hongxin Shi, Yujie Liu

Institution: Henan University of Science and Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: Henan University

OpenAlex ID: W2012201531

FWCI: 0.354

Cites: 20

Cited by: 13

Related to: 10