Work

Via filling: Challenges for the plating process for conveyorised production

Year: 2012

Type: conference-paper

Source: International Microsystems, Packaging, Assembly and Circuits Technology Conference

DOI: 10.1109/impact.2012.6420232

Authors: Stephen Kenny, Nina Dambrowsky, Olivier Mann

Institution: Atotech (Germany)

Language: English

Topic: Electrodeposition and Electroless Coatings

Subfield: Surfaces, Coatings and Films

Field: Materials Science

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2012268865

FWCI: 1.981

Cites:

Cited by: 1

Related to: 10