Work

Soldering in Electronics, Second Edition

Year: 1990

Type: article

Source: Journal of Electronic Packaging

DOI: 10.1115/1.2904362

Authors: R. J. Klein, A. J. Rafanelli

Institution: Raytheon (United States)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2012468508

FWCI: 0.936

Cites:

Cited by: 13

Related to: 10