Work

Effect of plasma process on low-k material and barrier layer performance

Year: 2005

Type: article

Source: Thin Solid Films

DOI: 10.1016/j.tsf.2005.09.160

Authors: X.T. Chen, D. Gui, Z.Q. Mo, A.Y. Du, D.Z. Chi, W.D. Wang, Y.H. Wang, D. Lu, L.J. Tang, W.H. Li, L.Y. Wong

Institutions: Singapore Science Park, Institute of Microelectronics, Institute of Materials Research and Engineering

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2013257585

FWCI: 0.36

Cites: 7

Cited by: 9

Related to: 10