Work

Non-etching adhesion promoter for dry film for semi-additive manufacturing — Advanced dry film pre-treatment

Year: 2013

Type: conference-paper

Source: International Microsystems, Packaging, Assembly and Circuits Technology Conference

DOI: 10.1109/impact.2013.6706633

Authors: D. Tews, F. Michalik, R. Haidar, M. Thoms, Mengliau Goh, Simon Li

Institution: Atotech (Germany)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2013406512

FWCI:

Cites: 1

Cited by: 2

Related to: 10