Work

Resin / Rosin Free Solder Pastes and Fluxes

Year: 2006

Type: conference-paper

Source: Electronic System-Integration Technology Conference (ESTC)

DOI: 10.1109/estc.2006.280129

Author: Wolfgang Schmitt

Institution: Heraeus (Germany)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2013450331

FWCI:

Cites:

Cited by: 2

Related to: 10