Work

Reliability improvements for advanced Wafer Level packaging

Year: 2010

Type: conference-paper

Source: Electronic System-Integration Technology Conference (ESTC)

DOI: 10.1109/estc.2010.5642883

Authors: John Hunt, Danial Huang, Jessica Chiu, MaggieMC Liu, Junior Lin, JW Lou, Chienfan Chen, Chin-Li Kao

Institution: Advanced Semiconductor Engineering (Taiwan)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2014566599

FWCI: 1.283

Cites: 1

Cited by: 5

Related to: 10