Work

3D via modeling simplification on multilayer mid-planes

Year: 2011

Type: conference-paper

Source: IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

DOI: 10.1109/epeps.2011.6100228

Authors: Qian Li, Kathleen L. Melde, Gong-Jong Yeh, Hui Wu, Yaochao Yang

Institutions: University of Arizona, Cisco Systems (United States)

Language: English

Topic: Electromagnetic Simulation and Numerical Methods

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2014862265

FWCI: 0.434

Cites: 4

Cited by: 1

Related to: 10