Work

Investigation of agglomerated Cu seed on Cu oxidation after chemical mechanical planarization

Year: 2010

Type: article

Source: Applied Surface Science

DOI: 10.1016/j.apsusc.2010.07.030

Authors: Jeng-Yu Lin, Shu-Wei Chou, Min-Yuan Cheng

Institutions: Tatung University, Taiwan Semiconductor Manufacturing Company (Taiwan)

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

Funder: National Science Council

OpenAlex ID: W2015247233

FWCI:

Cites: 19

Cited by: 3

Related to: 10