Work

Mechanism of Direct Copper Plating on Nonconducting Substrates

Year: 1999

Type: article

Source: Journal of The Electrochemical Society

DOI: 10.1149/1.1391580

Authors: Sachiko Ono, Tetsuya Osaka, Kazuhisa Naitoh, Yutaka Nakagishi

Institutions: Waseda University, Okuno Chemical Industries Co., Ltd. (Japan)

Language: English

Topic: Electrodeposition and Electroless Coatings

Subfield: Surfaces, Coatings and Films

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

Funder: Waseda University

OpenAlex ID: W2015265132

FWCI: 1.87

Cites:

Cited by: 20

Related to: 10