Work

High-frequency ultrasonic wire bonding systems

Year: 2000

Type: article

Source: Ultrasonics

DOI: 10.1016/s0041-624x(99)00173-0

Authors: Jiromaru Tsujino, Hiroyuki Yoshihara, Tsutomu Sano, Shigeru Ihara

Institution: Kanagawa University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: Ministry of Education, Culture, Sports, Science and Technology, Mashhad University of Medical Sciences

OpenAlex ID: W2015449058

FWCI:

Cites: 2

Cited by: 32

Related to: 10