Work

Using Ozawa method to study the curing kinetics of electrically conductive adhesives

Year: 2014

Type: article

Source: Journal of Thermal Analysis and Calorimetry

DOI: 10.1007/s10973-014-3902-4

Authors: Hui-Wang Cui, Jin-Ting Jiu, Shijo Nagao, Tohru Sugahara, Katsuaki Suganuma, Hiroshi Uchida

Institutions: The Institute of Scientific and Industrial Research, The University of Osaka, The University of Osaka, Showa Denko (Japan)

Language: English

Topic: Thermal and Kinetic Analysis

Subfield: Materials Chemistry

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2016129064

FWCI: 1.362

Cites: 51

Cited by: 17

Related to: 10