A study in flip-chip UBM/bump reliability with effects of SnPb solder composition
Year: 2005
Type: article
Source: Microelectronics Reliability
Authors: J.D. Wu, P.J. Zheng, C.W. Lee, S.C. Hung, J.J. Lee
Institution: Advanced Semiconductor Engineering (Taiwan)
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2016137694