Development of High Temperature SiC Based Hydrogen/Hydrocarbon Sensors with Bond Pads for Packaging
Year: 2012
Type: article
Abstract: This paper describes efforts towards the transition of existing high temperature hydrogen and hydrocarbon Schottky diode sensor elements to packaged sensor structures that can be integrated into a testing system. Sensor modifications and the technical challenges involved are discussed. Testing of the sensors at 500°C or above is also presented along with plans for future development.
Source: Materials science forum
Institutions: Glenn Research Center, Makel Engineering (United States)
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: green
OpenAlex ID: W2016191457