Work

Wire bonding using copper wire

Year: 2009

Type: article

Source: Microelectronics International

DOI: 10.1108/13565360910923115

Author: Z.W. Zhong

Institution: Nanyang Technological University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2016209010

FWCI: 4.382

Cites: 72

Cited by: 77

Related to: 10