Work

Accurate electrical simulation and design optimization for silicon interposer considering the MOS effect and eddy currents in the silicon substrate

Year: 2012

Type: conference-paper

Source: IEEE Electronic Components and Technology Conference (ECTC)

DOI: 10.1109/ectc.2012.6248902

Authors: Jing Zhou, Lixi Wan, Fengwei Dai, Huijuan Wang, Chongshen Song, Tianmin Du, Yanbiao Chu, Maoyun Pan, Daniel Guidotti, Liqiang Cao, Daquan Yu

Institutions: Chinese Academy of Sciences, Institute of Microelectronics

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2016389311

FWCI: 2.438

Cites: 9

Cited by: 7

Related to: 10