Prerequisite for maximizing thermal conductivity of epoxy laminate using filler
Year: 2012
Type: article
Authors: K. C. Yung, H. Liem, H. S. Choy
Institution: Hong Kong Polytechnic University
Language: English
Subfield: Materials Chemistry
Field: Materials Science
Domain: Physical Sciences
Open Access status: closed
Funder: Innovation and Technology Fund
OpenAlex ID: W2016805624