Work

New technologies for advanced high density 3D packaging by using TSV process

Year: 2008

Type: conference-paper

Source: International Conference on Electronic Packaging Technology (ICEPT)

DOI: 10.1109/icept.2008.4606939

Authors: Paul Kettner, Bioh Kim, Stefan Pargfrieder, Swen Zhu

Institution: EV Group (Austria)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2017443179

FWCI: 2.843

Cites:

Cited by: 15

Related to: 10