Work

The growth kinetics of intermetallic layers at the interface of a solid metal and a liquid solder

Year: 2009

Type: article

Source: JOM

DOI: 10.1007/s11837-009-0015-9

Author: V. I. Dybkov

Institution: Frantsevich Institute for Problems in Materials Science

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2017633397

FWCI: 2.062

Cites: 23

Cited by: 19

Related to: 10