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Compact Modeling of Data Center Air Containment Systems

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Year: 2013
Type: conference-paper
Source: ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK)
DOI: 10.1115/ipack2013-73325
Authors: Xuanhang (Simon) Zhang, James W. VanGilder, Christopher M. Healey, Zachary R. Sheffer
Institutions: Schneider Electric (United States), Northeastern University
Language: English

Topic: Heat Transfer and Optimization
Subfield: Mechanical Engineering
Field: Engineering
Domain: Physical Sciences

Open Access status: closed
OpenAlex ID: W2018190171
FWCI: 1.022
Cites:
Cited by: 7
Related to: 10
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