Constitutive Relations for Creep in a SnCu-Based Composite Solder Reinforced with Ag Particles
Year: 2009
Type: article
Source: Journal of Electronic Materials
Authors: Yaowu Shi, Yanfu Yan, Jianping Liu, Zhidong Xia, Yongping Lei, Fu Guo, Xiaoyan Li
Institution: Beijing University of Technology
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2018272864