Microstructure and Nanoindentation Hardness of Sputter Deposited Nanocrystalline Tantalum Thin Films
Year: 2011
Type: article
Abstract: Tantalum (Ta) thin film was deposited onto Si (100) substrates using direct-current magnetron sputtering. The structure and mechanical properties of Ta films were investigated by X-ray diffraction, Field emission scanning electron microscope, and nanoindenter. The results indicated a transition from regular to irregular Hall-Petch relationship with decreasing grain size. Besides, a peak indentation hardness value of 12.8 GPa, much higher than that of bulk coarse-grained Ta, was obtained at the grain size of 36.3 nm.
Source: Advanced materials research
Authors: Hao Liang Sun, Ming Wei
Institution: Henan University of Science and Technology
Language: English
Subfield: Mechanics of Materials
Field: Engineering
Domain: Physical Sciences
Open Access status: hybrid
OpenAlex ID: W2018290146
