Work

Ultra-Thin and High-Density Packaging Using Both Sides Flip Chip Technology

Year: 2003

Type: conference-paper

Source: ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK)

DOI: 10.1115/ipack2003-35066

Authors: Kazuto Nishida, Kazumichi Shimizu, Michiro Yoshino, Hideo Koguchi, Nipon Taweejun

Institution: Nagaoka University of Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2018480167

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