Work

Interfacial reactions between Sn-2.5Ag-2.0Ni solder and electroless Ni(P) deposited on SiCp/Al composites

Year: 2010

Type: article

Source: Transactions of Nonferrous Metals Society of China

DOI: 10.1016/s1003-6326(09)60242-9

Authors: Mao WU, Xuan-hui QU, Xin-bo HE, Rafi-ud-din, Shu-bin REN, Ming-li QIN

Institutions: State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2018729307

FWCI: 0.245

Cites: 31

Cited by: 19

Related to: 10