Work

Effect of indium on the microstructure of the interface between Sn3.13Ag0.74CuIn solder and Cu substrate

Year: 2009

Type: article

Source: Journal of Alloys and Compounds

DOI: 10.1016/j.jallcom.2009.02.110

Authors: Pavol Šebo, Zbigniew Moser, Peter Švec, Dušan Janičkovič, Edmund Dobročka, Wladyslaw Gasior, Janus Pstruś

Institutions: Slovak Academy of Sciences, Institute of Materials and Machine Mechanics of the Slovak Academy of Sciences, Institute of Metallurgy and Materials Science, Polish Academy of Sciences, Institute of Physics of the Slovak Academy of Sciences

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: Agentúra na Podporu Výskumu a Vývoja, Vedecká Grantová Agentúra MŠVVaŠ SR a SAV

OpenAlex ID: W2018992950

FWCI: 2.578

Cites: 7

Cited by: 33

Related to: 10