Work

New developer-soluble gap-fill material with fast plasma etch rate

Year: 2006

Type: conference-paper

Source: Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE

DOI: 10.1117/12.656703

Authors: Anwei Qin, Daniel M. Sullivan, Runhui Huang

Institution: Brewer Science (United States)

Language: English

Topic: Advancements in Photolithography Techniques

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2019485437

FWCI: 1.589

Cites: 3

Cited by: 3

Related to: 10