Potential low‐cost palladium‐alternatives for activating electroless copper deposition
Year: 2010
Type: article
Source: Circuit World
Author: Edith Steinhäuser
Institutions: Technische Universität Ilmenau, Atotech (Germany)
Language: English
Subfield: Surfaces, Coatings and Films
Field: Materials Science
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2019727283
