Analysis and Experimental Verification of the Volume Effect in the Reaction Between Zn-Doped Solders and Cu
Year: 2008
Type: article
Source: Journal of Electronic Materials
Authors: S.C. Yang, Y.W. Wang, C.C. Chang, C.R. Kao
Institution: National Taiwan University
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2020165537